| 摘要 |
The invention relates to an apparaus for ultrasonic wire bondings whereby the contact loci can be connected by wire straps, by means of ultrasonic welding, e.g. for connecting terminals on component mounts or the like to bonding islands on semiconductor chips. The inventive apparatus has means for combined axial and radial guiding of the rotatable bonding head, with low overall mass of the vertically movable parts and low moment of inertia around the rotational axis. As a result of the inventive disposition of the microscope objective, the object distance to the component can be set directly via the controllable vertical drive of the bonding head. |
