POLYALKENYLPHENOL COMPOUND

摘要

NEW MATERIAL:A polyalkenylphenol compd. of the formula (wherein R is H or methyl; X is H or a halogen atom; n is 0 or 1-10). USE:It is useful as a curing agent for epoxy resins, maleimide resins, etc., and a raw material for epoxy resins. It is possible to raise the glass transition temp. and to improve remarkably high-temp. mechanical strengths and a thermal expansion coefficient because the crosslinking density is increased by using this polyalkenylphenol as a curing agent for epoxy resins and maleimide resins. In addition, it is possible to shorten molding cycle as the glass transition temp. is elevated in a short time. PREPARATION:The aimed polyalkenylphenol is obtd. by the alkenylation of a polyphenol. The polyphenol (or its precursor) is obtd. by heating phenols and a hydroxybenzaldehyde in the presence of an acidic catalyst. The polyalkenylphenol is obtd. by preparing a phenolate from this polyphenol and then aryl-etherifying it.