| 摘要 |
PURPOSE:To keep processing from being complicated by forming a wafer mark and a mask mark in such mark shapes having similarity that a wafer mark derivation signal obtained by taking a first derivative to the wafer mark and a mask mark derivation signal obtained by taking a first derivative to the mask mark are nearly overlapped with each other by horizontally moving them. CONSTITUTION:The wafer mark and the mask mark are formed in such mark shapes having the similarity that the wafer mark derivation signal obtained by taking the first derivative to the wafer mark and the mask mark derivation signal obtained by taking the first derivative to the mask mark are overlapped by being horizontally moved. Then, similar pattern matching is performed to a signal obtained by the derivation of an image input signal. Thus, the relative position between the wafer mark and the mask mark can be recognized with high accuracy with simple processing. Moreover, throughput can be improved, a producing process can be simplified and producing efficiency can be enhanced. |
