| 摘要 |
<p>PURPOSE:To eliminate a problem in the suction of water content from a vacuum tweezers and moreover, to make possible the carrying-in of a water jet pump to a semiconductor device manufacturing field as well to make short the distance of a piping and to make possible a reduction in the cost of a motive power as well by a method wherein a negative pressure generation source is replaced with the water jet pump. CONSTITUTION:When the surface of a semiconductor substrate is sucked by a suction part of a vacuum tweezers 2 in the water, water content is sucked in completely from the suction part, but the sucked water component joins the water content of a motive power and is excluded by a water jet pump 1 and the suction from the suction part does hardly cause a problem in a reduction in the power of the pump itself. Moreover, as a rotation part is unnecessary for the pump 1 and oil content for preventing an overheating due to the friction of a rotating axis is also never used, the pump results in being carried in to a semiconductor device manufacturing field as well without worries about contamination and a piping 3 also can be sufficed at a short distance. Furthermore, as both a rise and a fall of the operation of the pump 2 can be executed instantaneously and stably by opening and shutting a valve 5, a wasteful motive power can be omitted by interrupting rapidly a water current source 4 by the valve 5 when the pump is unnecessary.</p> |
