| 摘要 |
PURPOSE:To enlarge tensile strength and to elevate softening temperature by constituting a gold alloy fine wire for bump formation out of specific weight% of Pd, and one or two or more among La, Ce, and Ca, and Au and inevitable impurity for the rest, in wireless bonding. CONSTITUTION:An alloy fine line for gold pump is made of alloy consisting of 0.5-10weight% of Pd, 0.0001-0.02weight% of one or two or more among La, Ce, and Ca, and Au and inevitable impurity for the rest. To make it a normal dissolving method is used, and molten gold alloy is adjusted so that it may be specific composition and then it is rolled using a channel rolling mill. Thereafter, wire drawing processing is done to make it into a fine wire with a line diameter of 25mum. If it is done this way, when forming a ball at the end of the fine line by an electric torch, it can put the thermal effect length of a neck part which lowers the tensile strength, that is, recrystallization area in extremely short range, and it never cuts at this point. |
