| 摘要 |
PURPOSE:To ensure the current capacity of a common electrode without increasing cost approximately, and to attain miniaturization and the reduction of cost by installing a conductive wire rod between a protective cover for a thermal head and a wiring on a substrate and pushing the wire rod so as to conduct the wire rod and the common electrode on the substrate. CONSTITUTION:A heating resistance layer 2 and a wiring layer 3 are formed onto an insulating substrate 1, and patterned successively through a technique such as photoetching. These wiring patterns may be shaped by using a thick-film technique. A protective layer 4 protecting the heat generating section of a heating resistor and the wiring layer, etc. is formed, and an IC 5 for drive and an external leading-out terminal 6 are connected, thus manufacturing a thermal head. When a cover protecting the thermal head is mounted, a conductive wire rod 7 is set up previously in parallel with the common electrode of the thermal head in a section just above the common electrode. The conductive wire rod is pushed against the common electrode on the substrate by the cover under the state, thus conducting the wire rod and the common electrode. |
