Method for testing the strength of the soldered joints between the power supply leads and the contents of wafer-shaped electrical components and device for carrying out the method

摘要

The components (1) are held by means of dies (10, 11), the soldered joints (6, 7) being left free. From both sides, a respective pressure pin (12, 13) is guided on to the power supply leads (4, 5) in the vicinity of the outer edge (14) of the components (1). Each pressure pin (12, 13) exerts a force on the respective power supply lead (4, 5) in the direction of tearing off, until a set value of the testing force is reached. <IMAGE>