RESIN MOLDING DIE AND MANUFACTURE OF RESIN-MOLDED ITEM,申请号JP19880243339-传众专利搜索

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发明名称	RESIN MOLDING DIE AND MANUFACTURE OF RESIN-MOLDED ITEM
摘要
申请公布号	JPH0289610(A)	申请公布日期	1990.03.29
申请号	JP19880243339	申请日期	1988.09.28
申请人	SONY CORP	发明人	WATANABE YOSHIO
分类号	B29C33/38;B29C45/37;C25D1/00	主分类号	B29C33/38
代理机构		代理人
主权项
地址

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