| 摘要 |
PURPOSE:To efficiently rectify it according to the degree of warpage by arranging a heat insulating sheet whose thickness is varied over the whole length freely in sliding between cooling plates of a cooler, and bringing the specific thickness part of the heat insulating sheet into close contact with the inside of one cooling plate so as to cover it. CONSTITUTION:The temperature at the surface side 1a where a warp is occurring in a printed wiring board 1 in a cooling process is lowered than that at the rear side 1b. Hereby, the surface side 1a is cooled quickly, and tensile stress turns out to work, and the warpage is corrected, but by bringing a heat insulating sheet 3 into close contact with the inside of a cooling plate 2 where the rear side 1b of the printed wiring board 1 is located so as to cover it, temperature difference can be set between both cooling plates 2 even if the temperature of the cooling plate itself is not adjusted. The surface side 1a of the printed wiring board 1 turns out to be cooled quickly by other cooling plate 2, and a warp is rectified. Moreover, since the thickness of the heat insulating sheet 3 varies over the whole length, by bringing the specific thickness part into close contact with the inside of the cooling plate so as to cover it, temperature difference can be set specifically between cooling plates 2, thus it can be made to cope with the degree of the warpage. |
