| 摘要 |
PURPOSE:To make it possible to assemble a semiconductor device having above 200 pins or more by a method wherein a relay point having conductivity is formed between the electrode of a semiconductor device and the terminal of a board such as a lead frame and a metallic fine wire for connecting the electrode and the terminal is connected to the relay point. CONSTITUTION:An insulation material fixation section 9 is disposed so as to be connected to a tie bar 4. An insulation material having a conductive relay point 8 is bonded thereon with an epoxy adhesive. The insulation material fixation section 9 can be formed easily by etching or pressing at the same time as other lead frames at lead frame manufacturing time. The relay point should be disposed on the insulation material by, for example, deposition. In the method of connecting a metallic fin wire 6 by wire bonding, an electrode 2 and a relay point 8 are connected, then the relay point 8 and a terminal 5 are connected. If this operation is performed on a required electrode, connection is completed. Relaying the metallic fine wire 6 lengthens a total length of the metallic fine wire two times. |
