发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent influence of damage on the surroundings and to intercept entrance of moisture by forming a recessed or projecting step between a pad and a wiring and by forming a surface protecting film on an insulating film corresponding to the step. CONSTITUTION:In an insulating film 2 between a pad 3 and an aluminum wiring 4 formed on the insulating film 2, there are formed two parallel lines of intermittently disposed recessed opening 10 steps. A protecting film is provided by successively laminating an SiO2 film 5 and a PSiN film 6 on the insulating film 2, wherein the openings 10-10 are formed, and on the pad 3 and the aluminum wiring 4. Further, a flattened film may be formed on the PSiN film 6 by using, for example, PSG(phosphorus silicate glass). In this way, generation of local stress is prevented when a mold 9 is formed.
申请公布号 JPH0289321(A) 申请公布日期 1990.03.29
申请号 JP19880241983 申请日期 1988.09.27
申请人 SONY CORP 发明人 KOIKE YOICHIRO
分类号 H01L23/52;H01L21/316;H01L21/318;H01L21/3205;H01L21/768;H01L23/522 主分类号 H01L23/52
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