| 摘要 |
PURPOSE:To reduce a pressure applied to a chip and shorten the time for applied pressure by applying pressure and transferring, with a rubber stamp, silver paste discharged to a specialized nozzle by a dispenser. CONSTITUTION:When silver paste is discharged from the front end of a discharge nozzle 5, a rubber stamp 8 is pressed against the discharge nozzle 3 with a vertically driving cylinder (A) 10. Silver paste discharged by the pressing is transferred onto the rubber stamp 8 while it is extended to the groove of the end of the discharge nozzle 5. After transfer, the rubber stamp 8 stops on an intermediate position by the vertically driving cylinder (B) 11, then is rotated 180 deg. by a rotary cylinder 9. Next, silver paste is applied to a lead frame by the vertically driving cylinder (B) 11. When application is finished. it is raised to the bottom surface of the discharge nozzle 5 by the vertically driving cylinder (A) 10. Thereafter. repeated operation is performed. Thus, a silver paste application surface, transferred onto a rubber surface, the same dimension as a uniform chip area, can be obtained on a lead frame.
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