| 摘要 |
PURPOSE:To keep an interval between light receiving picture elements constant even between each IC image sensor chip by selecting a picture element pitch at the time of manufacturing the IC image sensor chip by considering thermal expansion of the IC image sensor chip. CONSTITUTION:Each IC image sensor chip 3a-3e is fixed to a substrate 2 at the time of curing of a die bonding adhesive 6, therefore, the length of the chip is formed in advance somewhat longer than prescribed length by considering this curing temperature. Accordingly, at the time of using at a room temperature, a picture element pitch P as an image sensor becomes a desired picture element pitch, and as for a picture element pitch in a joint part between each chip, as well, an exact picture element pitch can be obtained in the same way. In such a manner, a read quality can be improved extending over the overall length of the image sensor. |
