| 摘要 |
PURPOSE:To eliminate variations in products and to improve copper etching accuracy by carrying out copper etching with a batch-type etching device while monitoring etching conditions of a copper etching monitor pattern electrically. CONSTITUTION:After a hole is shaped on a double-sided copper laminated board, electric plating is made to make a surface conductive through a plated copper 7. Etching resist is applied at a circuit formation process. A copper etching monitor pattern is also exposed to a board end section like other circuit. Then development is made and an etching resist section of an unexposed section is eliminated. Then a connector 3 of a copper etching monitor pattern is mounted to a copper etching monitor pattern. A from the connector is connected to a low resistance measuring device. Copper etching is made by a batch-type vertical etching device and change of conductive resistance is observed through a copper etching monitor. End of etching can be known by etched copper and independent line. |
