| 摘要 |
PURPOSE:To prevent the unexpected plating and deposition of Ni and to automatically control an electroless Ni plating soln. by changing the pH, Ni concn., and temp. as the number of turns increase, and appropriately interlocking the supply of the pH regulator and Ni component. CONSTITUTION:The pH, Ni concn., temp., etc., are changed with the changes in the components of the electroless Ni plating soln. as the number of turns increase to fix the deposition rate and composition. In this method for automatically controlling the plating soln., the pH regulator is not supplied while the Ni component is supplied. When the temp. is rapidly elevated and a base heater is operated, the Ni component is not supplied. The supply of the components is interlocked in this way, hence unexpected plating due to a partial increase in pH and the deposition of Ni on a heater, etc., are prevented, and the plating soln. is controlled as the number of turns increase. |
