发明名称 TARGET FOR MAGNETRON SPUTTERING
摘要 PURPOSE:To stabilize strength ratio between respective components and also to prolong the service life of a target by detaching chips embedded in the base material of a target and the eroded regions of the base material on the peripheries of the above chips from the base material of the target and replacing the above-mentioned chips and eroded regions. CONSTITUTION:A base material 2 composed of a primary substance, such as SiO2, provided on a backing plate 1 is embedded with chips 3 composed of a secondary substance, such as Tb, so that respective surfaces of the chips 3 are allowed to appear, and the primary and the secondary substance mentioned above are sputtered simultaneously. In the above target for magnetron sputtering, each detachable and replaceable part 6 is constituted of the above chip 3 composed of the secondary substance and an eroded region 2' composed of the primary substance in the periphery of the chip 3. Respective parts 6 mentioned above are replaced at the point of time when differences in level due to erosion are formed in the above parts 6. By this method, the strength ratio, e.g., of Tb to SiO2 can be recovered, and the base material 2 can be used semipermanently.
申请公布号 JPH0288769(A) 申请公布日期 1990.03.28
申请号 JP19880241806 申请日期 1988.09.27
申请人 FUJITSU LTD 发明人 MIHARA MOTONOBU;TSUTSUMI MASAMI;NAKAJIMA HIDEKAZU;NAITO KAZUNORI;NUMATA TAKEHIKO
分类号 C23C14/34 主分类号 C23C14/34
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