| 摘要 |
PURPOSE:To shorten the time for bonding operation, to realize a high-density mounting operation and to prevent cracking of a wafer during the bonding operation by a method where a circuit board of a tape carrier system by using a substrate provided with a bump, bumps for protrusion bonding use are formed both at the tip part of a finger lead and at the tip part of an outer lead. CONSTITUTION:A bump 18 for bonding use is formed at the tip of a finger lead 17 with reference to an aluminum pad 16 of an IC 13; a bump 20 for bonding use is formed also at the tip of an outer lead 19 corresponding to a wiring part 11 formed on an outer substrate 12. A substrate base film 21 of a polyimide or the like fixes all leads. The IC 13 is bonded via the bump 18 for bonding use formed on the finger lead 17 formed on the substrate base film 21; the IC 13 is connected; after that, the substrate base film is cut at A-A, B-B, C-C and D-D. After that, a protrusion 20 at the tip part of the outer lead 19 is aligned with the wiring part 11 formed on the outer board 12; an outer bonding operation is executed by using a bonding tool 31 with a built-in heater 30. |
