| 摘要 |
PURPOSE:To improve the yield of a surface emitting diode array device while enabling it to be packaged in a smaller size and to eliminate deterioration in characteristics due to thermal interference by mounting a surface-emitting element array on a heat sink upside-down. CONSTITUTION:A surface-emitting diode array 14 is mounted upside-down on a heat sink 26 through a fusion bonding section 23 so that a surface-emitting array device 13 is provided. The surface-emitting diode array apparatus 13 thus constructed can perform heat radiation more efficiently and deterioration in characteristics of elements due to thermal interference can be reduced since the light-emitting element array 14 is mounted upside-down on the heat sink 26. Further, since no bonding operation is required, mass production of such devices is facilitated and, further, such device can be packaged in a smaller size. |
