| 摘要 |
PURPOSE:To obtain a high frequency package by providing a conductor layer so as to surround a coplanar waveguide structure on the surface of plural thin insulation sheets and connecting inter-conductor layers, the conductor layer, and a ground layer of a high frequency input output terminal of coplanar guide path structure electrically so as to form a frame. CONSTITUTION:A front and a rear side a thin ceramic green sheet is subject to W paste at a prescribed part to form a conductor layer 9. The layers are eliminated, an opening 12 is formed and a W paste is buried. The W paste is coated to a prescribed part of a wall face of a laminated base 8. Finally, a base 8 is overlapped to the conductor layer on the surface of the ceramic or the metallic base 3 while clipping silver solder and it is roasted at a high temperature. The obtained frame 1 is partitioned electrically into inner and outer portions by conductor layers 9, 10 in continuity with the conductor layer or the metallic base 3 on the surface of the base being a ground layer 7 and the inductance and resistance of peered hole 12 are reduced. The equivalent effect to the metallic frame is obtained except the high frequency input output terminal of the coplanar guide path structure in the frame and the high frequency characteristic is improved. |
