发明名称 INTERCONNECTION SYSTEMS FOR ELECTRICAL CIRCUITS
摘要 PCT No. PCT/GB87/00203 Sec. 371 Date Nov. 23, 1987 Sec. 102(e) Date Nov. 23, 1987 PCT Filed Mar. 24, 1987 PCT Pub. No. WO87/06092 PCT Pub. Date Oct. 8, 1987.Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks (110). Link members (126, 128) are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission. stacks.
申请公布号 GB2191896(B) 申请公布日期 1990.03.28
申请号 GB19870007013 申请日期 1987.03.24
申请人 * DOWTY ELECTRONIC COMPONENTS LIMITED 发明人 MICHAEL JOHN * ANSTEY
分类号 H01L23/32;H01L23/52;H01L23/538;H01R12/70;H01R33/76;H01R33/88;H01R33/92;H05K7/02 主分类号 H01L23/32
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