| 摘要 |
<p>PURPOSE:To improve joining strength by joining a metallized layer which has been formed via a specified middle layer on the surface of an insulating base material calcined at low temp., to the metallized layer formed on the surface of AlN member via high temp. soldering material. CONSTITUTION:A middle layer 27 contg. both one kind or two or more kinds of metals which are selected from Cu, Ag, Ag-Pb, Ni and have 0.5-2mum mean particle diameter and glass having 1-3mum mean particle diameter contained in an insulating base body 17 calcined at low temp. and a metallized layer 29 are formed on the surface of the base body 17 having 2-6.5X10<-6>/C deg. thermal expansion coefficient. Then both the metallized layer 29 on this base body 17 and a plated metallic layer 25 on the surface of a metallized layer 23 formed on the surface of AlN base plate 11 are joined via high-temp. soldering material 35.</p> |
