| 摘要 |
PURPOSE:To improve chemical resistance and abrasion resistance, by providing an adherence intensified layer, a laser light reflecting layer and a protecting layer on a substrate, using one of a metallic film and a dielecric multilayer film, as the reflecting layer, and using a hard metallic film, as the protecting layer. CONSTITUTION:On a substrate 1 of a copper plate, etc., an adherence intensified layer 4 consisting of one of Cr, Ni and W is provided. Subsequently, a laser light reflecting layer 2 consisting of one of gold, silver and copper is formed. On this layer, a tungsten W layer being a hard metal is formed within a range of 100-800Angstrom thickness by a vacuum depositing method, by which a protecting layer is obtained. In this way, abrasion resistance of the surface, and chemical resistance are improved. It is also possible to directly from the W protecting film 5 on a copper substrate 6 to which nonelectrolytic Ni plating has been performed. |
