| 摘要 |
PURPOSE:To reduce a product cost, to simplify the manufacturing process and to improve bondability between leads and bonding wires by providing a previously coated solder layer on outer leads instead of providing a coat layer both on a tab and inner leads. CONSTITUTION:In a resin-sealed semiconductor device 1, external terminals 4C of a semiconductor chip 4 are formed of an aluminum alloy doped with an element for reducing migration (e.g., Cu), while bonding wires 5 are formed of a metallic material having hardness substantially equivalent to that of the external terminals 4C (Cu or an alloy thereof). A lead frame 2 of the resin-sealed semiconductor device 1 is formed of a precipitation hardened copper material (containing 0.05 to 0.15% Zr). A solder coat layer 7 is provided by the previously solder coating technique on the surface of outerlead sections 2C but not on the surface of tab sections 2A or inner lead sections 2B. The solder coat layer 7 is provided by a high-melting solder consisting of 75 to 95% lead and 25 to 5% tin. |
