| 摘要 |
PURPOSE:To enable processing for making a through hole and plating the inner wall thereof in a short move by immersing a printed circuit board into plating liquid and applying a laser beam to the printed circuit board. CONSTITUTION:A printed circuit board 4 is fixed in a plating bath 2, the plating bath 2 is mounted on an X-Y table and moved to the suitable position for processing for making a through hole 4a in the printed circuit board 4, and the through hole 4a is made by applying a laser beam 1a. When a vibrator 3 for ultrasonic cleaning having a protection film against plating liquid 2a is installed therein, a carbide in the center of the through hole 4a made in the printed circuit board 4 with the laser beam is removed to complete the through hole and enable forming only a solid carbide layer on the inner wall of the through hole 4a. The carbide layer thus formed on the inner wall of the through hole 4a in the printed circuit board 4 acts as an active molecule and electroless copper plating is performed. The hole is thus made and plated in succession only with application of the laser beam; therefore, the move can be remarkably shortened. |
