| 摘要 |
PURPOSE:To improve various characteristics as an insulation film and obtain a multilayer interconnection board by forming an organic compound film which does not dissolve to polyamic acid on a Cu wiring. CONSTITUTION:After Cu is deposited on a board the surface of which is thermally oxidized, a Cu film 2 is formed and immersed is a benzimidazole solution 3, washed with water and dried. As a comparison material, a specimen which is not processed is made on the film 2. Next, polymide varnish is applied on respective films 2, the surface of which is processed with the solution 3 and not processed with the solutions 3. It is heated and a polymide film 4 is obtained. Cu is deposited on the film 4 and electrodes 5 that oppose are formed. As above, when the surface of a Cu wiring is processed with an organic compound solution not containing S atoms and a new compound film 15 formed on the surface of the Cu wiring as the result of the reaction between Cu and an organic compound, a base Cu wiring film is prevented from dissolving to polyamic acid in polymide varnish. |
