| 摘要 |
PURPOSE:To provide the supporter of a chip fixing pad with required stepped part doing no damage even if the supporter becomes relatively short due to enlarged chip size by a method wherein the part in parallel with the side held by the supporter of a semiconductor chip fixing pad is turned into a supporter whereon the stepped part is provided. CONSTITUTION:The title sealed semiconductor device formed of a lead frame on whose central part a semiconductor chip 12 fixing pad 13 connecting to a supporter 14 at the side is arranged is provided with the following three elements i.e., 1) a notch part 18 provided in parallel with said side and inside said pad 13 near said side 2) a rectangular region comprising a supporter forming region formed between the notch part 18 and said side as well as 3) a stepped rib type supporter 14 formed by rolling the rectangular region assuming the plane of said pad 13 as the lower surface and the planes of the central linear part 14b of said rectangular region and the leads 15 of the lead frame as the upper surface. It is recommended that the width of said notch part 18 is specified to be around the thickness of the island (pad) 13. |
