| 摘要 |
PURPOSE:To fix a heat radiating element which is attached to the outside of a molded resin unit at a fixed position by a method wherein a fixing means such as a set of protrusions or recesses to which at least a part of the heat radiating element is fitted is provided at least on one of the surfaces of the molded resin unit. CONSTITUTION:The respective electrode terminals of a semiconductor chip are connected to the one side ends of lead parts 3 and molded with resin. The outer ends of the lead parts 3 are drawn out from the two sides of the molded resin unit 1. Further, a pair of protrusions 4 are provided on each of the two surfaces of the molded resin unit 1 from which the lead parts 3 are not drawn out. A heat radiating element 2 which is attached to the outside of the molded resin unit 1 has portions which hold both the ends of the molded resin unit 1 and the portions are fitted between the respective pairs of the protrusions 4 for fixing. With this constitution, the misalignment created at the time of attaching the heat radiating element and the positional change and detachment caused by vibrations and impacts given after the attachment can be avoided. |
