| 摘要 |
PURPOSE:To prevent tandelta from being deteriorated even with sealing by forming a negative electrode leads such that at least a partial surface thereof includes a plate-shaped metal connected to a conductive layer, and boring a through-hole through a surface thereof to which said plate-shaped metal is connected. CONSTITUTION:A negative electrode lead connected onto a conductive layer comprises a plate-shaped metal or that but to which a columnar thin metal wire is welded, and at least a partial surface of the plate-shaped metal is connected onto the conductor layer. The connected part of the plate-shaped metal should include one or more through-holes therethrough without limitation thereto by the shape thereof such as a circle and a rectangle, etc. As the rate of the through-hole occupying the connection part of the plate-shaped metal connected onto the conductor layer is increased, there is advantageously reduced a change in tandelta before and after the sealing. If the area ratio of hole with respect to the area of the plate-shaped metal of the connected part is 10% or more, a solid electrolytic capacitor of allowable performance can be produced. |
