| 摘要 |
PURPOSE:To obtain a wiring board excelling in suppressing the occurrence of electrolytic corrosion by making the wiring board having an inner layer circuit conductor isolated from reinforced fiber in an insulating layer with insulating resin. CONSTITUTION:In the case of a multiwire wiring board, insulating resin layers 1 are formed on the surfaces of an insulating resin plate 2 comprising reinforced tiber and insulating resin to form the wiring board having an inner layer circuit conductor isolated from the reinforced fiber in the insulating layer with the insulating resin. Copper foil 3 is piled on the surfaces of the insulating resin layers 1 and integrated by heating, pressurizing, and laminating to make a copper-clad laminated plate. The unnecessary parts of the copper foil 3 of the copper-clad laminated plate are removed by etching to make an inner circuit plate 5. The insulating resin layers 1 of the inner circuit plate 5 are formed to make an inner circuit board 6. Bond resin layers 7 are formed on the surfaces of the inner circuit board 6 and insulating wires 101 are laid and fixed. A hole is made in the part where connection is required and the inner wall thereof is metallized to form a through hole 102. |
