| 摘要 |
PURPOSE:To enable high density wiring and to include highly precise resistors by forming one or more unbaked circuit sheets, forming an insulating layer of insulating paste, pressurizing for flattening the surfaces of the outer layers of the unbaked circuit sheets, and forming surface conductor patterns on the surfaces of the outer layers. CONSTITUTION:The required number of through holes 12 are made in an unbaked green sheet 11. Resistor paste of the specific shape, area, and thickness is printed on the specific part of the sheet 11 to form a resistor pattern 13. Conductor paste of the specific shape, area, and thickness is printed on the specific part of the sheet 11. Conductor patterns 14 acting as the inner conductors of this sheet 10 are formed therewith. In this time, connecting conductors 14a are put in the through holes 12. Insulating paste is printed on the sheet 11 to form an insulating layer 15 of the specific pattern. In forming the insulating layer 15, the part except exposed openings 15a and 15b is covered. |
