| 摘要 |
<p>PURPOSE: To detect a deviation of a cutting passage in a range ofμm during cutting step with good reliability and reproducibility by forming a predetermined magnetic field for passing wafers between a measuring unit and a cutting tool, and detecting a change of the field. CONSTITUTION: A cutting blade 2 has, for example, a section of a drip shape and a nickel sheath in which diamond cut particles are embedded. A capsule and a predetermined magnetic field for passing a wafer 12 to be cut are formed between a magnet 11 and a cutter/cutting blade system. When the cutter is moved to the magnet during cutting, an attraction force between both is changed, and a measured value detected by a force measuring meter is varied as well. It is recorded by a measuring amplifier 13 in response to it. And, the measuring unit uses, for example, an optical comparing system to match the cutter to a desired predetermined position, and then the force can be corrected by utilizing that the force depends upon a deviation of the cutter.</p> |
