发明名称 Modular electronic power circuit - with power components supported by metallised ceramics layer and enclosed by overlying insulation layer
摘要 The modular electronic power circuit uses at least one ceramic layer (1) coated on both sides with a metal layer (2,15), with the power components (10) supported by one of the metal layers (2). The latter metal layer (2) carries a further insulating layer (5) in selected areas excluding those supporting the power components Pref. the metal layer (2) can act as conductor paths, or external current connections for the power components (10), with the latter contained within openings (6) in the ceramics insulating layer (5). The latter may support the electronic control circuit components (8) for the power components (10). ADVANTAGE - Provides thermal isolation of power components.
申请公布号 DE3930858(A1) 申请公布日期 1990.03.22
申请号 DE19893930858 申请日期 1989.09.15
申请人 MAIER, PETER H., 8560 LAUF, DE;SCHULZ-HARDER, JUERGEN, DR.-ING., 8489 ESCHENBACH, DE 发明人 MAIER, PETER H., 8560 LAUF, DE;SCHULZ-HARDER, JUERGEN, DR.-ING., 8489 ESCHENBACH, DE
分类号 H01L25/16;H05K1/02;H05K1/03;H05K1/05;H05K1/18;H05K3/40 主分类号 H01L25/16
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