FLEXIBLE PIN CARRIER AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME

摘要

PURPOSE:To avoid adhesion of solder along a conductive elastic fine wire which is soldered to a semiconductor element or a printed board even if the solder adheres to the parts other than the bonding part of the fine wire and avoid the degradation of the elasticity of the fine wire by a method wherein a board which also holds the end parts of the fine wires is provided on the end parts of the fine wires. CONSTITUTION:Two boards 1 and 2 made of different materials are linked with each other by bonding a large number of conductive elastic fine wires 3. Connection pads 5 connected to the fine wires 3 are provided outside both the boards 1 and 2. The board 1 is placed on the side of a semiconductor element or a semiconductor element mounting part and made of material such as ceramics which has a thermal expansion coefficient equivalent to that of the material of the semiconductor element. The board 2 is placed on the side of a multilayer printed board side and made of material such as ceramics or resin which has a thermal expansion coefficient equivalent to that of the material of the multilayer printed board. Further, the fine wire 3 is required to have an elasticity sufficient to absorb the difference in thermal expansion coefficient between the boards 1 and 2 and to have a resistance as small as possible. Kovar, copper, copper alloy or the like may be employed as the material of the fine wire 3. Thermosetting resin is used as the resin 4 fixing the fine wires 3 to the boards 1 and 2. The connection pads 5 are made of copper and connect the boards 1 and 2 to each other.