| 摘要 |
<p>An integrated circuit having improved planarity including a substrate (41), a plurality of transistors integrated into a top surface of the substrate, and a plurality of insulating layers (e.g., 21) over the top surface which are interleaved with respective sets of signal conductors (e.g. 20a and 20b). The signal conductors are spaced apart on the insulating layers and are routed through holes in the insulating layers to the transistors in order to carry signals to and from the transistors. Also, in accordance with the invention, the integrated circuit further includes dummy conductors (22) on the insulating layers (21) in the spaces between the signal conductors (20a and 20b). These dummy conductors are open circuited and consequently carry no signals. Their function is purely mechanical; and specifically, they function to partially fill the spaces between the signal conductors such that an overlying insulating layer can be formed without peaks and valleys. For ease of fabrication, these dummy conductors are formed with the same mask and by the same steps as the signal conductors; and they are of the same material and have the same thickness as the signal conductors.</p> |
