| 摘要 |
<p>PURPOSE:To make possible the minimization of a bonding action to be transmitted to an IC module side, if such an action brought to bear upon the IC card is significant by providing a notch which absorbs an external bending action, outside the adhesive area of an IC module in the recessed part of a card base. CONSTITUTION:A notch 36 is provided, as if it encircles the first recessed part 35a, on the entire periphery of the first recessed part 35a on a card base 30. This notch 36 forms a belt-like quadrangle as viewed from a planar angle. The notch 36 consists of a notch 36a which crosses the longitudinal direction of the card base 30 at right angles and a notch 36b which runs in parallel with the longitudinal direction of the card base 30. An adhesive 34 is arranged at the bottom of the first recessed part 35a formed on the card base 30, and an IC module is inserted into the first recessed part. The adhesive 34 is shaped so that it fits the interior of the notch 36. Thus the bending action applied to an IC card 10 can be absorbed by the notches 36a, 36b arranged outside an adhesive area. Consequently, the bending action transmitted to the IC module 11 from the card base 30 through the adhesive area is minimized.</p> |
