| 摘要 |
PURPOSE:To miniaturize a thermal head and to prepare the same in low cost at high yield from the aspect of a manufacturing process by forming a common electrode to the end part of a base and providing a glaze layer so as to form a structure covering the common electrode partially and forming a heating region thereof. CONSTITUTION:A common electrode layer 1 is formed to an insulating base 2 and predetermined patterning is performed by a photoetching technique. This common electrode layer 1 may be formed using thick film technique. Thereafter, an insulating layer 3 is formed and predetermined patterning is performed. Then, a heating resistor layer 4 and wiring 5 are formed to successively complete patterns. Over-etching is intensionally performed when the common electrode layer is etched to make it possible to smooth the step part at the pattern end part of the common electrode layer. By this method, a small-sized thermal head and having the good contact properties with thermal paper can be obtained without forming a partial glaze layer. |
