| 摘要 |
A thick film, multi-layer interconnected circuit board includes a substrate of an electrical insulating material which will withstand high temperatures, such as alumina, having over a surface thereof a plurality of stacked layers of a glass dielectric. Between each pair of dielectric layers is a thick film conductor layer. The dielectric layers have openings or vias therethrough which are filled with a conductive material which makes electrical contact with the adjacent conductive layers. A contact pad is over the topmost dielectric layer and is electrically connected to a via conductor material in the topmost dielectric layer. The contact pad is of a thick film conductive material which is a layer of glass having particles of a conductive material, such as a noble metal or mixture of noble metals, dispersed therein. A bonding layer is between the contact pad and the topmost dielectric layer and is bonded to both. The bonding layer is of a mixture of the glass of the dielectric layers and the thick film conductive material of the contact pad.
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