发明名称 SURFACE ABRASIVE APPARATUS FOR PRINTED WIRING BOARD
摘要 PURPOSE:To obtain a finished surface in which regions of plugged holes are properly polished without abrading a copper foil excessively by providing a brush holder of an abrasion section with a plurality of nozzles for injecting an abrasive solution and with a plurality of brush bundles while covering the brush bundles with a mesh-type abrasive cloth. CONSTITUTION:A brush body 41 includes an elongated and planar rectangular plate 44 on which a plurality of brush bundles 45 are planted. The plate 44 is provided with nozzles 46 through which an abrasive solution is to be injected. A mesh-type abrasive cloth 43 consisting of cloth of metallic fibers woven in mesh covers the brush bundles of the brush body 41. A printed wiring board 2 is transported into an abrasive machine through an opening 13 (or 14) and advansed towards the abrasive brush section 40 by means of a transporting apparatus 3. The brush body is eccentrically moved by means of an eccentric shaft 12 while the abrasive solution is injected through supply ports 47 and the nozzled 46, so that the surface 2a of the board 2 is abraded without damaging the copper foil surface of the board. In this manner, the surface 2a can be abraded as required while UV setting resin (or thermosetting resin) is removed effectively.
申请公布号 JPH0277192(A) 申请公布日期 1990.03.16
申请号 JP19890161679 申请日期 1989.06.23
申请人 CMK CORP 发明人 SEKI KAMEHARU;KUBO ISAMU
分类号 B24B29/02;H05K3/00;H05K3/26 主分类号 B24B29/02
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