| 摘要 |
<p>PURPOSE:To stably manufacture a large board whose raw material is cheap and manufacturing cost is low and which enables a high frequency signal to propagate at a high speed and is high in mechanical bending stress resistance by a method wherein chip type electronic components are built in a multilayer resin substrate. CONSTITUTION:A multilayer resin board 9 composed of laminated two or more resin boards 2-6 including a board provided with a recessed part or a through- hole, chip type electronic components 24-26 housed in spaces 21-23 composed of the recessed part or the through-hole, and conductive patterns 13-20 provided between layers or inside the through-hole to wire the electronic components 24-26 are provided. Resin boards are used as a multilayer board as mentioned above, so that a raw material and a manufacturing cost can be made low, a high frequency signal can be propagated at a high speed, and the multilayer board can be made high in mechanical bending stress resistance. And, a large multilayer board con be stably manufactured, so that the multilayer board can be applied for such as an IC card or the like which is subject to bending stress from the outside.</p> |
