| 摘要 |
<p>PURPOSE:Not only to improve a circuit design in the degree of freedom but also to enable the simplification of a packaging process and the micronization of a circuit unit by a method wherein a circuit chip provided with a resistor is fitted to a cutout section of an inner printed wiring board. CONSTITUTION:A circuit chip 5, which is composed of a board 2' formed of the same material as a board 2 and a thin layer resistor 4 formed on the surface of the board 2', is fitted to a cutout section 3 of an inner printed wiring board 7 composed of the glass-epoxy resin board 2 and circuits 6 formed on both the sides of the board 2, and an outer printed wiring board 9 is laminated on the front and the rear side of the board 7 and the circuit chip 5 through the intermediary of a prepreg 8. The circuit chip 5 is connected to an outer circuit 6' through the intermediary of a through-hole 10 and functions as a resistor. Therefore, a multi-layered printed wiring board of this design can be used without packaging a resistor or an outer layer. By this setup, specially a circuit design of an outer layer is almost free from restriction, elements and others are easily packaged, and a circuit unit can be miniaturized in size.</p> |
