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发明名称
SEALING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH0274054(A)
申请公布日期
1990.03.14
申请号
JP19880225758
申请日期
1988.09.09
申请人
NEC KYUSHU LTD
发明人
SUGIMOTO MITSUO
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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