发明名称 BUS BAR CIRCUIT BOARD AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To achive perfect insulation and water-proof performance and to enable high density wiring by integrally molding bus bars having a desired pattern in planar through insulators and sealing holes made through punching of a coupling chip for coupling adjoining bus bars. CONSTITUTION:A board M where bus bars 18a, 18b... having desired pattern are punched out except a coupling chip 19 is molded integrally with an insulator 20. Then a tab insertion hole 21 is made at a desired position of each bus bar and the coupling chip 19 is cut off. Finally, a tab 23 is pressure inserted into the tab insertion hole 21 only at a desired position. By such arrangement, each bus bar is insulated through the integral mold of the insulator 20 and causes no leak nor imperfect operation. Furthermore, the circuit pattern can be substantially varied by varying the inserting position and the number of the tab 23 even if the pattern of the bus bar is identical.</p>
申请公布号 JPH0274114(A) 申请公布日期 1990.03.14
申请号 JP19880223497 申请日期 1988.09.08
申请人 YAZAKI CORP 发明人 OZAKI KEIICHI;SAIMOTO TETSUROU
分类号 H01R43/24;H01R9/24;H02G3/16;H05K1/00;H05K1/02;H05K3/20;H05K7/06 主分类号 H01R43/24
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