| 摘要 |
<p>PURPOSE:To enable easy high-density mounting with a simple process by covering a board with adhesive after creating a metallic projection on a circuit conductor of a board and heating and pressing parts to be mounted so as to bond them. CONSTITUTION:A metallic projection 3 is created at a conductor 2 forming the circuit of a board 1 by electrodeposition, etc., and the circuit of the board 1 is covered with adhesive 4 by adhesive application or lamination. Next, when mounting parts such as a chip resistor 5, a ceramic package 6, etc., are bonded using a heating tool 10 and an arrangement tray 9 by heating and pressing, the mounting parts are bonded onto the board 1 and at the same time they are connected electrically to the conductor 2 of the board 1 through the projection 3, and further the circuit pattern is protected by the adhesive 4 at the part where the parts are not mounted. By this method wherein solder is not used, a mounting board where the high density mounting can be done easily with a simple process can be made.</p> |
