| 摘要 |
PURPOSE:To reduce the rigidity of a diebond pad part so as to decrease the effects of stress and crack to a mold resin material for semiconductor chip by making a diebond pad part into a linear substance which is formed in such a shape that a semiconductor chip can be placed on its upper face. CONSTITUTION:A lead frame for semiconductor device 2 is equipped with a diebond pad part 6 constituted of Peano curves and plural leads 5 which are formed radiatedly at its circumference. Also, the pad part 6 is formed into a curved linear substance 6a made of copper and iron or these alloy, and suspension leads 8 which can support the parts are formed in a body at four corner parts, and the pad part 6 is divided into plural square regions, and the shapes of some parts of the Peano curves formed in the divided region are all constituted in joint or similar figures, and the rigidities of the pad part 6 are made almost equal so as to reduce the effects of stress and crack to a mold resin material for semiconductor chip. |
