| 摘要 |
PURPOSE:To enable to speed-up bonding by eliminating the break of a fine wire by coating the surface of said wire for wire-bonding a semiconductor device with surface active agent while setting the thickness at a specific value, when said wire multilayer-wound on a spool is made of Au or Au alloy. CONSTITUTION:When the Au or Au alloy fine wire is wound up on the Al spool in one-layer winding or cross-multilayer winding, the surface of the fine wire is kept coated with anion surface active agent, particularly polyoxyethylenealkylethersulfate and nonionic surface active agent, particularly polyoxyethylenealkylether, while setting the thickness at 0.5mum-50Angstrom . Thus, the break or the deformation loop does not generate in the fine wire, and said wire can be made continuous in the winding amount as long as 500-1,000m. |
