| 摘要 |
PURPOSE:To improve the yield rate in manufacturing to a large extent by using a Bernoulli chuck as a means for moving a semiconductor chip, feeding ionized air into the chuck, and removing static electricity accumulated in the semiconductor chip. CONSTITUTION:For example, a high frequency current 15 is made to flow through air which is fed into a Bernoulli chuck 10, or a DC high voltage is applied to the air. Thus corona discharge is generated, and the air is ionized. The ionized air 16 is fed into an opening part 13 through an air hole 12. A semiconductor chip 5 is sucked, moved to a die pad and bonded. Since the ionized air 16 is fed into the Bernoulli chuck 10, the Bernoulli chuck 10 sucks the semiconductor chip 5. The electrostatic ions accumulated in the semiconductor chip 5 during the sucking are neutralized with ions in the air, completely discharged and removed. In this way, the manufacture yield rate can be improved to a large extent. |
