| 摘要 |
PURPOSE:To obtain a high heat radiating effect for the tilted device by a method wherein a tab and a heat radiating part are directly contacted tightly in a high output semiconductor device which generates profuse heat when it is in operation. CONSTITUTION:A pellet 4 is fixed to the upper surface of the tab 1 and connected to the inner end of a lead 2 using a wire 5. The inner end part of the lead 2, tab 1, pellet 4, wire 5 are molded and they are covered by a package 6 which consists of resin. The lower surface of the tab 1 is exposed by providing a fitting hole 7 in the center of the lower surface and a heat radiating part 8, consiting of copper, aluminum and the like, is adhered. Then, the lead 2 is bent downward and a dual-in line type semiconductor device 9 is manufactured. The point of the fitting protrusion 11 on the heat radiating part 8 is fixed to package 6 using a bonding material (thermoplastic high heat conducting resin) 12, and a fin 13 is formed on the lower surface part of the main body 10, thereby enabling to increase the heat radiating property of the device. |
