| 摘要 |
PURPOSE:To form a wiring pattern characterized by a high aspect ratio, a thick wiring layer and a high density with excellent productivity by forming an insulating film with a polyimide resin whose main component is the repeating unit of a specified chemical formula. CONSTITUTION:The pattern of a photoresist film 4 is transferred to a polyimide film 3, and a machining groove 5 is formed. A plate growing pattern for a copper thin film 2 is exposed, and a copper plated layer 6 is formed and filled. A thick copper wiring layer is formed. At this time, the insulating film 3 is formed with a polyimide resin whose main component is the repeating unit of a Formula I, where R represents the organic group of a bivalent aromatic group. Since the insulating film 3 is formed with the polyimide resin in this way, high resistance against alkali plating liquid is shown when electroless copper plating is performed, and the insulating material is not dissolved. In this constitution, the polyimide insulating film is thick, pattern droop does not occur and the electroless plating advances. Therefore, the wiring layer characterized by a high aspect ratio and the thick film can be formed. |
