发明名称 FLEXIBLE BASE PLATED WITH COPPER
摘要 PURPOSE:To improve the bonding strength and resistance to curls by forming directly on the surface of a copper foil a resin layer composed of a composite of polyimide and polyimide silicone respectively having a repeating unit represented by a specific formula. CONSTITUTION:A resin layer formed of a composite of polyimide having a repeating unit represented by a formula I and polyimide silicone having a repeating unit represented by a formula II is formed directly on the surface of a copper foil. R<1> is an aromatic hydrocarbon group represented by formulae III and IV, R<2> representing a fatty hydrocarbon group having not more than 5 carbons or an aromatic hydrocarbon group having 9 or less carbons, R<3> representing a tetravalent aromatic hydrocarbon group, R<4> representing a biva lent aromatic hydrocarbon group, R<5> representing a cyclohexan chain, R<6> representing a bivalent fatty hydrocarbon group having 3-5 carbons or a bivalent aromatic hydrocarbon group having 6-9 carbons. Y represents -O-, -CO-, -SO2- or -CH2-. Further, (r) is 2 or 3, and (x:y) is 97-60:3-40, (m:n) is 50-100:50-0.
申请公布号 JPH0270429(A) 申请公布日期 1990.03.09
申请号 JP19880214185 申请日期 1988.08.29
申请人 CHISSO CORP 发明人 KONOTSUNE SHIRO;KIKUTA KAZUTSUNE;UETSUKI MASAYA;HASE HIROAKI
分类号 B32B15/08;B32B15/088;C08G73/10;C09D179/08;H05K1/03 主分类号 B32B15/08
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