发明名称 CONDUCTIVE RESIN COMPOSITION FOR MOLDING AND ELECTROMAGNETIC SHIELD STRUCTURE
摘要 PURPOSE:To manufacture a structure of superior electromagnetic function by coating a conductive fiber composition for giving electromagnetic shield function with thermoplastic resin or a filling material composite plastic resin of given heat deformation temperature range in one direction and using a conductive fiber composite resin composition of two kinds or more of pellet-shaped compositions of given length. CONSTITUTION:A conductive fiber is a metallic fiber or metal coated fiber and constituted at least of two kinds of thermoplastic resin of 80-210 deg.C heat deformation temperature are used. A continuous conductive material line constituted of metallic bundle fibers is manufactured by using said conductive fiber and thermoplastic resin or thermoplastic resin including the filler and setting a crosshead in an extruder and being constituted of said thermoplastic resin is cut into the given length of 3-10mm to manufacture column-shaped pellets. A casing for an electronic instrument can be molded by using said pellets of given length and an ordinary injection molding material.
申请公布号 JPH0270404(A) 申请公布日期 1990.03.09
申请号 JP19880222352 申请日期 1988.09.07
申请人 HITACHI LTD 发明人 GOTO MASAO;WARATANI KENICHI;IIDA MAKOTO;OTA AKIICHI;IWAI SUSUMU
分类号 B29B9/06;B29B9/14;B29C45/00;B29K105/12;C08J3/12;C08K7/00;C08K7/06 主分类号 B29B9/06
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